TOKYO--(BUSINESS WIRE)--Renesas Electronics Corporation (TSE: 6723), a premier supplier of advanced semiconductor solutions, today announced that it has delivered the industry’s first complete memory ...

Avid readers of Tom’s Hardware have read a lot about the upcoming HBM4 and GDDR6 memory technologies, but as neither is used ...

Renesas Electronics Corp. claims the industry’s first complete memory interface chipset solutions for the second-generation DDR5 MRDIMMs. The chipset solutions include a new multiplexed registered ...

Synopsys, Inc. today announced the immediate availability of the DesignWare® DDR PHY compiler, supporting DDR2, DDR3, LPDDR and LPDDR2 SDRAMs. “As a leading fabless design integrator, GUC is committed ...

This is the first of a three-part series on HBM4 and gives an overview of the HBM standard. Part 2 will provide insights on HBM implementation challenges, and part 3 will introduce the concept of a ...

High Bandwidth Memory (HBM) is the commonly used type of DRAM for data center GPUs like NVIDIA's H200 and AMD's MI325X. High Bandwidth Flash (HBF) is a stack of flash chips with an HBM interface. What ...

Introduces industry-leading LPDDR5 CAMM2 PMIC and DDR5 Gen 2 Client PMIC alongside Client Clock Driver and SPD Hub for high-performance notebooks, desktops and workstations Supports wide range of ...

CEO Luc Seraphin highlighted that Rambus exceeded revenue guidance in Q4 2024 and achieved a record annual product revenue of $247 million, driven by strong performance from memory interface chips and ...

New Multiplexed Registered Clock Driver, Multiplexed Data Buffer and PMIC Enable Next-Generation MRDIMM Speeds up to 12,800 Mega Transfers per Second for AI and High-Performance Compute Applications ...