Extensive Array of Back-End and Advanced Packaging Wet Wafer Process Equipment Leverages ACM’s Experience to Address Emerging Requirements for Wafer-Level Packaging FREMONT, Calif., Oct. 15, 2020 ...

SAN JOSE — A consortium of chip-equipment makers here today announced a major deal with Ace Semiconductor to help set up the world's first wafer-level packaging production line in China. Under the ...

FREMONT, Calif., Sept. 04, 2024 (GLOBE NEWSWIRE) -- ACM Research, Inc. (ACMR) (“ACM”) (NASDAQ: ACMR), a leading supplier of wafer processing solutions for semiconductor and advanced wafer-level ...

Incorporating the NanoResolution MRS sensor, the WX3000 Metrology and Inspection systems enable the ultimate combination of high speed, high resolution and high accuracy for wafer-level and advanced ...

CARLSBAD, Calif.–Asymtek Inc., a supplier of automated fluid dispensing equipment for IC makers, here announced that it has joined the Advanced Packaging & Interconnect Alliance (APiA). Formed in late ...

Samsung Electronics has stepped up its deployment in the fan-out (FO) wafer-level packaging segment with plans to set up related production lines in Japan, according to industry sources. Samsung has ...

LONDON--(BUSINESS WIRE)--The global fan-out wafer level packaging (FOWLP) market is expected to post a CAGR of almost 16% during the period 2019-2023, according to the latest market research report by ...

Packaging houses are readying their next-generation advanced IC packages, paving the way toward new and innovative system-level chip designs. It’s a confusing landscape with a plethora of buzzwords ...

Advanced packaging that’s no bigger than the die itself brings together high performance and high reliability with small size and low cost. Not so long ago, defense and aerospace applications were the ...

Heidelberg, Germany – Heidelberg Instruments, a global player in direct write technology and solution provider for the advanced packaging market, is transforming the semiconductor industry with its ...

Tanja Braun, group manager at Fraunhofer Institute for Reliability and Microintegration (IZM), sat down with Semiconductor Engineering to talk about III-V device packaging, chiplets, fan-out and panel ...